Design Issues of BAW Employment in 3D integrated Sensor Nodes

TitleDesign Issues of BAW Employment in 3D integrated Sensor Nodes
Publication TypeConference Paper
Year of Publication2009
AuthorsPrainsack, J., Dielacher M., Flatscher M., Herndl T., Matischek R., Stolle J., & Weber W.
Conference NameSymposium on Design, Test, Integration&Packaging of MEMS/MOEMS
Volumen/a
Pages81 - 85
Date PublishedApr
Citation KeyID46353