Design issues of BAW employment in 3D integrated sensor nodes

TitleDesign issues of BAW employment in 3D integrated sensor nodes
Publication TypeJournal Article
Year of Publication2010
AuthorsPrainsack, J., Dielacher M., Flatscher M., Herndl T., Matischek R., Stolle J., & Weber W.
JournalMicrosystem technologies
Volume16
Pages1037 - 1043
URLhttp://www.springerlink.com/content/911r082471425665/
Citation KeyID46356